FIERA MILANO 14-17/10/2020
Cerca espositori, prodotti e news
Cerca espositori, prodotti e news



2022-02-14 - Aggiornamento dell'azienda 3D SYSTEMS SOFTWARE S.R.L.

3D SYSTEMS SOFTWARE S.R.L.: 3D Systems Application Innovation Group is glad to support #semiconductor capital equipment manufacturers with the new A6061-RAM2 material from Elementum 3D, now available for our DMP Flex 350 metal additive manufacturing (AM) 3D printer. For example, this generatively designed wafer table is intended to maximize heat transfer efficiency for higher throughput and accuracy. In addition to its light weight, A6061-RAM2 is known for its high thermal coefficient, high strength, and high-cycle fatigue. Without any silicon content, A6061-RAM2 produces parts with an excellent surface finish at fast print speed. Contact us to begin exploring the benefits of A6061-RAM2 for your metal AM applications Learn more about the benefits of metal AM for wafer table thermal management at #semiconductorindustry #semiconductor #semiconductormanufacturing #semicon #wafers #wafer

ultime news